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Synthesis and Performance of Colloidal Silica Nano-Abrasives with Controllable Size for Chemical Mechanical Planarization

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Under the analysis of particle growth mechanism, the monodisperse colloidal silica abrasives for chemical mechanical planarization (CMP) slurry were synthesized by the modified ion-exchanged and hydrothermal step-polymerization process. After the colloidal silica with controllable size was synthesized, its microstructure, stability and CMP performance was characterized and tested by SEM, HRTEM, Zeta potential Analyzer and CMP tester. Results show that the spherical, high stable (Zeta potential: −52.8 mV) colloidal silica with controllable size was achieved. About its CMP performance, the polishing rate for silicon double-side CMP is increased to be 317 nm/min and the polished surface roughness (RMS) was reduced to 0.32 nm.
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Keywords: CMP SLURRY; COLLOIDAL SILICA NANO-ABRASIVE; CONTROLLABLE SIZE

Document Type: Research Article

Publication date: 01 February 2009

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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