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Formation of Copper Based Nanoparticles Embedded in a Relatively Thick Polyimide Film by Thermal Curing in Reducing Atmosphere

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We investigated the formation of nanoparticles in a relatively thick polyimide (PI) film (>1 μm) in controlled atmospheres and optical properties of these nanoparticles. Polyamic acid of 10 wt% BPDA-PDA was spin-coated on the 25 nm Cu thin film and thermally cured at 350 °C in high purity nitrogen or 5% H2 + 95% N2 atmosphere. The fabricated nanoparticles in high purity nitrogen atmosphere had spherical shape and were dispersed in the 1.5 μm thick PI film. Its phase was revealed as Cu and Cuprous Oxide by X-ray diffraction (XRD). Its size and optical absorption depended on deposited metal thin film thickness. After post heat-treatment in 5% H2 + 95% N2 atmosphere, surface plasmon resonance from metallic Cu nanoparticle was enhanced. In the specimens cured in reducing atmosphere, 5% H2 + 95% N2, highly dense and 3.5 nm size nanoparticles were well dispersed in an entire PI film. XRD results and optical data revealed that nanoparticles fabricated in 5% H2 + 95% N2 atmosphere were metallic Cu. Thermal curing in reducing atmosphere produces nanoparticles of high density, and uniform dispersion in a relatively thick PI film.
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Keywords: METALLIC CU NANOPARTICLES; POST HEAT-TREATMENT; THERMAL CURING IN REDUCING ATMOSPHERE

Document Type: Research Article

Publication date: 01 October 2008

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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