Pulse Electrodeposition of Ni-W Alloy for Trench Filling in Microelectromechanical Systems

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The effect of pulse current (PC) on Ni-W alloy electrodeposition was investigated to fill the trenches with aspect ratio 1:2 for MEMS applications. Rapid deposition of top side in trench produced a void in electrodeposits with direct current (DC). Morphology of Ni-W electrodeposition inside trench was strongly influenced by the applied current density and the current off-time (toff). Enhanced filling phenomena were observed with increasing current off-time because of decreasing concentration gradient between top and bottom in trench. The complete Ni-W filling of trench was achieved with a current density of 200 mA/cm2 and a current on- and off-time of 100 ms and 300 ms, respectively. Amorphous structure was revealed in both DC and PC electrodeposits and the concentration of W in Ni-W electrodeposits for complete filling of trench was about 24% in atomic ratio.


Document Type: Research Article

DOI: http://dx.doi.org/10.1166/jnn.2008.1189

Publication date: October 1, 2008

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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