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Electronic Punch on the Thiolated-Au Films by Atomic Force Microscopy

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To measure the thickness of SAMs, ellipsometry using a p-polarized laser beam is commonly used, which provides indirect information on the entire surface. Herein, a direct method for estimating the thickness of multilayered thiolated-Au films using atomic force microscopy (AFM) oxidation is described. When a bias voltage is applied to thiolated-Au films, the sulfur-gold bond is readily cleaved via a desorption procedure, and the nano-explosion through electron tunneling occurs at the nano-contact between the probe tip and surface. A multi-step uncovered layer is obtained, which can be used to estimate the thickness of each layer (organic and gold). This procedure is referred to as "electronic punch" of AFM, and is applicable to thiolated-Au films.


Document Type: Research Article


Publication date: October 1, 2008

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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