Self-Assembly of Au-Ag Alloy Nanoparticles by Thermal Annealing

Authors: Yao, R.H.; She, J.C.; Xu, N.S.; Deng, S.Z.; Chen, Jun

Source: Journal of Nanoscience and Nanotechnology, Volume 8, Number 7, July 2008 , pp. 3487-3492(6)

Publisher: American Scientific Publishers

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Abstract:

Hemispherical Au-Ag alloy nanoparticles were prepared on 2-inch Si wafer by thermal annealing Au-Ag alloy thin film in protective ambient. The nanoparticles were evenly distributed on the substrate surface. The diameter of the nanoparticles is dependent of the deposition duration of the Au-Ag alloy thin film, and also the separation between the nanoparticles. The minimum and maximum diameters of the nanoparticles obtained so far are about 5nm and 160 nm, respectively. Experimental evidences indicated that the formation of the hemispherical nanoparticles is due to the surface tensile stressing induced by the lattice expansion.

Keywords: SELF-ASSEMBLY; AU-AG ALLOY NANOPARTICLES; THERMAL ANNEALING

Document Type: Research article

DOI: http://dx.doi.org/10.1166/jnn.2008.133

Publication date: 2008-07-01

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