Y0.9Er0.1Al3(BO3)4 Thin Films Preparedby the Polymeric Precursor Methodfor Integrated Optics
Abstract:This work reports on the optimization of Y0.9Er0.1Al3(BO3)4 thin films for integrated optics. The films were deposited on silica and silicon substrates using the spin-coating technique involving solutions previously prepared by the polymericprecursor method. These deposits, 400–800 nm thick, were prepared by a 5–10 multi-layer process and heat treatments at different temperatures from glass transition to crystallization temperature, using heating rates of 2 or 5 °C/min. The structural characterizations were performed using grazing incidence X-ray diffraction and Fourier transform infrared spectroscopy (FT-IR). Water and/or hydroxyl contents were also evaluated from FT-IR spectra. Microstructural evolution in term of annealing temperatures was analyzed by high resolution scanning electronic microscopy and atomic force microscopy. Optical transmission spectra were used to determine the refractive index and thickness through the envelope method of the films. Finally, the film guiding and optical properties were studied by m-line spectroscopy. The best film showed a good waveguiding with high light-coupling efficiency close to the theoretical limit.
Document Type: Research Article
Publication date: October 1, 2007
More about this publication?
- Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
- Editorial Board
- Information for Authors
- Subscribe to this Title
- Terms & Conditions
- ingentaconnect is not responsible for the content or availability of external websites