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Thermal-Mechanical Properties of a Graphitic-Nanofibers Reinforced Epoxy

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We previously developed a series of reactive graphitic nanofibers (r-GNFs) reinforced epoxy (nanoepoxy) as composite matrices, which have shown good wetting and adhesion properties with continuous fiber. In this work, the thermal-mechanical properties of the nano-epoxy system containing Epon Resin 828 and Epi-cure® Curing Agent W were characterized. Results from three-point bending tests showed that the flexural strength and flexural modulus of this system with 0.30 wt% of reactive nanofibers were increased by 16%, and 21% respectively, over pure epoxy. Fracture toughness increased by ca.40% for specimens with 0.50 wt% of r-GNFs. By dynamic mechanical analysis (DMA) test, specimens with 0.30 wt% of r-GNFs showed a significant increase in storage modulus E′ (by ca.122%) and loss modulus E″ (by ca.111%) with respect to that of pure epoxy. Also thermo-dilatometry analysis (TDA) was used to measure dimensional change of specimens as a function of temperature, and then, coefficients of thermal expansion (CTE) before and after glass transition temperature (T g) were obtained. Results implied that nano-epoxy materials had good dimensional stability and reduced CTE values when compared to those of pure epoxy.
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Keywords: GRAPHITE NANOFIBERS; MECHANICAL; REINFORCED EPOXY; THERMAL PROPERTIES

Document Type: Research Article

Publication date: 2007-03-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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