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Annealing Characteristics of Nano-Grained Oxygen Free Copper Processed by Accumulative Roll-Bonding Process

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Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding (ARB) were studied. A nano-grained oxygen free copper fabricated by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 300 °C for 0.6 ks. TEM observation revealed that the ultrafine grains still sustained up to 150 °C, however above 200 °C they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The tensile strength of the copper decreased largely above 200 °C. These annealing characteristics of the copper were compared with those of a commercially pure aluminum.


Document Type: Research Article


Publication date: 2006-11-01

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  • Journal for Nanoscience and Nanotechnology (JNN) is an international and multidisciplinary peer-reviewed journal with a wide-ranging coverage, consolidating research activities in all areas of nanoscience and nanotechnology into a single and unique reference source. JNN is the first cross-disciplinary journal to publish original full research articles, rapid communications of important new scientific and technological findings, timely state-of-the-art reviews with author's photo and short biography, and current research news encompassing the fundamental and applied research in all disciplines of science, engineering and medicine.
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