Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding (ARB) were studied. A nano-grained oxygen free copper fabricated by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 300 °C for 0.6 ks. TEM observation
revealed that the ultrafine grains still sustained up to 150 °C, however above 200 °C they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The tensile strength of the copper decreased largely above 200 °C. These annealing characteristics
of the copper were compared with those of a commercially pure aluminum.
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