@article {Jun:June 2006:1546-900X:22,
	author = "Jun, Wang",
	author = "Matham, Murukeshan V.",
	author = "Krishna, Juluri B.",
	author = "Ngoi, Bryan K.A.",
	title = "Inspection of Wafer Defects with Speckle-Shearing Interferometry and X-ray Microscopy",
	journal = "Journal of Holography and Speckle",
	volume = "3",
	year = "June 2006",
	abstract = "Subsurface defects below a polished wafer surface when undetected lead to high wafer rejection rates at the end of wafer processing. This paper presents a speckle-shearing interferometry approach to perform a real-time nondestructive, whole-field inspection on such unpolished Si-wafers with a strain resolution of 4.5 &#215; 10<SUP>&#8722;5</SUP>. The results obtained were later compared with X-ray microscopy under an image resolution of 0.67 <I>&#956;</I>m/pixel.",
	pages = "22-26(5)",
	url = "http://www.ingentaconnect.com/content/asp/jhs/2006/00000003/00000001/art00003"
	doi = "doi:10.1166/jhs.2006.003"
}