Electronic Speckle Correlation for Planar Placement Integrity Assessment
Authors: T.W. Ng; K.K. Cheong; S.H. Lau
Source: Journal of Holography and Speckle, Volume 1, Number 2, June 2004 , pp. 90-94(5)
Publisher: American Scientific Publishers
Abstract:
The electronic speckle correlation technique allows object displacement measurement despite the object being displaced and replaced back into the system. This feature is used here to ascertain the location integrity via a repeated placement test of an existing hoop lift and clamp ring design to locate wafers during sputtering that does not adequately meet the complete constraint requirements in kinematic positioning and a prototype model hoop lift and clamp ring design that meets the requirements. The nonconcentric location of a wafer in a semiconductor sputtering process may result in awkward drop-off as a result of aluminum sticking and consequently cause damage to the wafer. The measurement method helped to ascertain that the prototype model hoop lift and clamp ring design exhibited significantly improved levels of planar location integrity compared with the original design.Keywords: SPECKLE CORRELATION; PLACEMENT; WAFER; SPUTTERING; KINEMATIC POSITIONING
Document Type: Research article
DOI: http://dx.doi.org/10.1166/jhs.2004.014
Publication date: 2004-06-01
- The growing interest and activity in the fields of holography and speckle require a forum for rapid dissemination of important results. Journal of Holography and Speckle (JOHAS) is that international forum which offers scientists and engineers timely, peer-reviewed research in these fields. Journal of Holography and Speckle publishes original rapid communications, full research papers and timely state-of-the-art reviews (with author's biography and photo) encompassing the fundamental and applied research in all areas of holography, and speckle.
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