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Influence of Defects During the Tensile Deformation of Cu–Al Joint Interfaces at the Nano Scale

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Tensile deformation of a defective Cu/Al interface, which is used as a model system of heterogeneous metal interfaces, is explored using molecular dynamics simulations and compared with the mechanical behavior of copper grain boundaries. Results show that the heterogeneous bonding across the interface is a weaker link of the system during mechanical loading as compared with pure copper grain boundaries. Interfacial ductile fracture is the main mechanical failure mode accompanied by the nucleation and growth of voids near the interfacial region, which differs from the fracture mode of copper grain boundary. Evolution of the microstructures and its dependency on the external loading are examined with the interface models during the deformation process. In some cases of a defective interface, the nucleation of partial dislocation loops is observed and analyzed.


Document Type: Research Article


Publication date: October 1, 2011

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  • Journal of Computational and Theoretical Nanoscience is an international peer-reviewed journal with a wide-ranging coverage, consolidates research activities in all aspects of computational and theoretical nanoscience into a single reference source. This journal offers scientists and engineers peer-reviewed research papers in all aspects of computational and theoretical nanoscience and nanotechnology in chemistry, physics, materials science, engineering and biology to publish original full papers and timely state-of-the-art reviews and short communications encompassing the fundamental and applied research.
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