A Temperature-Time Map of Pressure-Assisted Diffusion Bonding in Al/Cu Bimetal and Its Microstructural Study
This paper deals with a study of pressure-assisted diffusion bonding of Al-Cu bimetal under a certain amount of pressure at various temperatures and holding times. Through a series of diffusion couple experiments under a constant load of 1600 kgf a temperature-time map of diffusion bonding in Al/Cu bimetal was constructed over a range of temperature from to 423 to 573 K with holding times varying 5 to 720 minutes. It suggests a good guideline for onset of diffusion bonding of the bimetal. According to micrographs by SEM diffusion layers were not clearly seen near the interface although it has enough bonding strength. After aging treatment for an hour a series of diffusion layers were evidently seen and the intermediate phases were identified by EDX point analyses. The intermediate phases present appeared to be combinations of hard intermetallics frequently occurred in Al-Cu binary system. Micro-Knoop hardness at the diffusion zone had much higher value than ones in matrices confirming them as intermetallics.
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Document Type: Research Article
Publication date: 2012-07-01
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